MX878
IXYS
28 LEAD 5MM X 5MM X 0.90MM QFN
PIN 1
(REF.)
MM.
MIN.
.80
0
.18
3.00
3.00
.45
28
MAX.
1.0
.05
.30
3.25
3.25
SIDE VIEW
.65
TOP VIEW
DIMENSIONS
DIM.
A
A1
A2
b
D
D2
E
E2
e
L
N
INCH
MIN.
.031
0
.007
.118
.118
MAX.
.039
.002
.012
.128
.128
.008 REF.
.197 BSC
.197 BSC
.0197 BSC
.0177 .0256
28
,200 REF.
5.00 BSC
5.00 BSC
.500 BSC
3. MOLDED PACKAGE SHALL CONFORM TO
JEDEC STANDARD CONFIGURATION
MO-220 VARIATION VHHD-1.
2. DIMENSIONS AND TOLERANCING CONFORM
TO ASME Y14.5M-1994.
1. COPLANARITY APPLIES TO THE EXPOSED
HEAT SINK SLUG AS WELL AS THE TERMINALS.
NOTES: (UNLESS OTHERWISE SPECIFIED)
BOTTOM VIEW
IXYS Corporation makes no representations or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither
circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS’ Standard Terms and Conditions of Sale,
IXYS Corporation assumes no liability whatsoever, and disclaims any expressed or implied warranty, relating to its products
including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any
intellectual property right
.
MX878
Drawing No. 087809
9
06/08/06
www.claremicronix.com
IXYS [ IXYS CORPORATION ]
