DSF1A ~DSF1J
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Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Case:
JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Laser band denotes cathode end
Weight:
0.017gram
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(T
A
= 25 °C unless otherwise noted)
Symbol
DSF1A DSF1B DSF1D DSF1F DSF1G DSF1J
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at Rated DC blocking voltage
T
A
= 25
℃
T
A
= 100℃
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
R
θJA
T
J
, T
STG
0.95
5.0
150
35
150
–55 to +150
50
35
50
100
70
100
200
140
200
1
25
1.25
1.7
300
210
300
400
280
400
UNIT
V
V
V
A
A
V
μA
nS
℃/W
℃
600
420
600
Maximum reverse recovery time
at I
F
= 0.5 A , I
R
= 1.0 A , I
rr
= 0.25 A
Typical thermal resistance
Operating junction and storage temperature range
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35
μm
thick)
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