Surface Mount Rectifiers
GL1A-GL1M
Features
Plastic package has
underwriters laboratory
flammability classifications
1
For surface mounted applications
Low profile package
Built-in strain relief,ideal for automated placement
Glass passivated chip junction
High temperature soldering:
250
o
C/10 seconds at terminals
1.6± 0.1
REVERSE VOLTAGE: 50 - 1000 V
CURRENT: 1.0 A
DO - 213AA
SOLDERABLE ENDS
D2=D1
＋
0
－
0.20
D2
Mechanical Data
Case:JEDEC DO-213AA,molded plastic over
1
passivated chip
Polarity: Color band denotes cathode end
Weight: 0.0014 ounces, 0.036 gram
D1
0.5± 0.1
3.5± 0.2
0.5± 0.1
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
o
C ambient temperature unless otherwise specified
GL1A
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forw ord rectified current
V
@T
L
=75
Peak
forw
ard
surge current
V
8.3ms
single
half-sine-w ave superimposed
V
on rated load (JEDEC Method)
Maximum instantaneous forw ard voltage at 1.0 A
Maximum DC reverse current
at rated DC blockjing voltage
@T
A
=25
o
C
@T
A
=125 C
o
GL1B
100
70
100
GL1D GL1G GL1J GL1K GL1M
200
140
200
400
280
400
1.0
30
1.2
5.0
1.3
600
420
600
800
560
800
1000
700
1000
UNITS
V
V
V
A
A
V
V
RRM
V
RWS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
t
rr
50
35
50
A
50.0
4.0
1.5
Typical junction capacitance(NOTE 2)
pF
S
o
Typical reverse recovery time(NOTE3)
Typical thermal resitance (NOTE
4)
perating junction temperature range
Storage temperature range
R
JA
T
J
T
STG
150
-55--------+150
-55--------+150
C/W
o
C
NOTE: 1.Measured
at 1.0MHz and applied reverse voltage of 4.0volts
2.Thermal
resistance form junction to ambient and junction to lead P.C.B mounted on 0.27"X0.27"(7.0X7.0mm2) copper pad areas
3.Measured with IF=0.5A,IR=1.0A,Irr=0.25A.
4.
Thermal resistance from junction to ambient and junction to lead P.C.B.mounted on 0.27''X0.27''(7.0X7.0mm2) copper pad areas
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