D
IELECTRIC
C
HARACTERISTICS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR / DF:
INSULATION RESISTANCE:
NPO
0 ± 30ppm /°C, -55 to 125°C
Q
>1,000 @ 1 MHz, Typical 10,000
X7R
± 15%, -55 to 125°C
16VDC DF
≤
3.5% @ 1 KHz, 25°C
10VDC DF
≤
5.0% @ 1 KHz, 25°C
>10 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
Size 01005: 0.2 - 10 pF
Size 0201: 0.2 - 100 pF
Size 0402: 0.2 - 33 pF
Size 0603: 0.2 - 100 pF
Size 0805: 0.3 - 220 pF
Size 1111: 0.2 - 1000 pF
Size 2525: 1.0 - 2700 pF
Size 3838: 1.0 - 5100 pF
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
>500
ΩF*
or 10 GΩ* @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
* whichever is less
2.5 X WVDC Min., 25°C, 50 mA max
1KHz ±50Hz, 1.0±0.2 VRMS, 25°C
100 - 10,000 pF
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO
SOLDERING HEAT:
Solder coverage
≥
90% of metalized areas
No termination degradation
No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
No mechanical damage
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R.
≥
1 G-Ohm
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R.
≥
10 G-Ohm
Breakdown voltage: 2.5 x WVDC
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260°±5°C solder for 10±1 sec.
Measure after 24±2 hour cooling period
Linear pull force* exerted on axial leads soldered to each terminal.
*0402
≥
2.0lbs, 0603
≥
2.0lbs (min.)
Glass epoxy PCB: 0.5 mm deflection
Applied voltage: 200% rated voltage, 50 mA max.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2% Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL CYCLE:
HUMIDITY,
STEADY STATE:
HUMIDITY,
LOW VOLTAGE:
VIBRATION:
10
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