TL431 Series
PRECAUTION FOR USE
Lead-Free Soldering Condition.
Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for
components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial
segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering
we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent
excellent reliability.
_
10 + 1sec
_
Peak : 260 + 3 C
250 C
Temperature ( C)
230 C
180 C
150 C
_
90 + 30sec
Preheating Zone
_
35 + 5sec
Reflow Zone
Time (sec)
[Lead-Free Soldering Temperature Profile]
1. When employing solder reflow method
1) Soldering Condition
Standard Condition : 250
Peak Condition : 260 3
2) Recommend temperature profile
3) Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
2. When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices
cause extensive localized temperature rise.
Please keep a reflow solder operating when Surface Mount Package s Soldering.
(Temperature), 10 1sec. (Time)
2008. 7. 3
Revision No : 0
6/6
KEC [ KEC(KOREA ELECTRONICS) ]
