ALUMINUM ORGANIC CAPACITORS
Performance Characteristics
Pad Dimensions
KEMET/EIA Size
Code
34. Storage Environment
AO capacitors are shipped in moisture barrier bags
with a desiccant and mositure indicator card. This
series is classified as MSL3 (Moisture Sensitivity
Level 3). Upon opening the moisture barrier bag,
parts should be mounted within 7 days to prevent
mositure absorption and outgassing. If the 7 day
window is exceeded, the parts can be dryed per the
instructions on the bag (168 hours at 40 5°C).
Z
G
X
Y (Ref) C (Ref)
2.55 6.35
D/7343-31, V/7343-20
X/7343-43
8.90
3.80
2.70
Table 6 - Land Pattern Dimensions for Reflow
Solder
31. Soldering
The A700 - AO-CAP family has been designed for
reflow solder processes, or for wave soldering. The
solder-coated terminations have excellent wetting
characteristics for high integrity solder fillets.
Preheating of these components is recommended to
avoid extreme thermal stress. Figure 6 represents
the recommended maximum solder temperature/
time combinations for these devices.
AO capacitors should be stored in normal working
environments. While the chips themselves are quite
robust in other environments, solderability will be
degraded by exposure to high temperatures, high
humidity, corrosive atmospheres, and long term stor-
age. In addition, packaging materials will be degrad-
ed by high temperature (reels may soften or warp,
and tape peel force may increase). KEMET recom-
mends that maximum storage temperature not
exceed 40 degrees C, and the maximum storage
humidity not to exceed 60% relative humidity. In
addition, temperature fluctuations should be mini-
mized to avoid condensation on the parts, and
atmospheres should be free of chlorine and sulfur
bearing compounds. For optimized solderability, chip
stock should be used promptly, preferably within 1.5
years of receipt.
Hand-soldering should be avoided. However, if nec-
essary it should be performed with care due to the
difficulty in process control. Care should be taken to
avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder
pad, applying solder between the pad and the termi-
nation, until reflow occurs. The iron should be
removed. "Wiping" the edges of a chip and heating
the top surface is not recommended.
Sn-Pb Profile
Sn-Pb Profile
Tape & Reel Packaging
300
250
200
150
100
50
5 Sec.
Case Codes
Tape & Reel Dimensions
Pitch
mm 0.1
Reel Quantity
Tape
Width
mm
45 Sec.
45 Sec.
KEMET
EIA
90 Sec.
Spro- 180mm 330mm
cket (7” dia.) (13” dia.)
Part
95 Sec.
200
0
V
D
X
7343-20 12 0.3
7343-31 12 0.3
7343-43 12 0.3
8
8
8
4
4
4
1000
500
3000
2500
2000
0
50
60 Sec.
100
150
Time (Seconds)
250
300
Figure 6 Sn-Pb Profile measured on the surface
of the component
500
* Contact KEMET for the latest A700 Pb-free sol-
dering recommendations.
Component Marking
32. Washing
Polarity (+)
Indicator
Standard washing techniques and solvents are com-
patible with all KEMET surface mount aluminum
capacitors. Solvents such as Freon TMC and TMS,
Trichlorethane, methylene chloride, prelate, and iso-
propyl alcohol are not harmful to these components.
Please note that we are not endorsing the use of
banned or restricted solvents. We are simply stating
that they would not be harmful to the components.
Picofarad
Code
476
6K
Rated
Voltage
KEMET ID
1st Digit = year
2nd & 3rd digits =
Week
424
If ultrasonic agitation is utilized in the cleaning
process, care should be taken to minimize energy
levels and exposure times to avoid damage to the
terminations.
Aluminum Component Weights
KEMET AO-CAPS are also compatible with newer
aqueous and semi-aqueous processes.
Typical Weight
Series
Case Size
(mg)
A700
A700
A700
V/7343-20
D/7343-31
X/7343-43
120
190
260
33. Encapsulations
Under normal circumstances, potting or encapsula-
tion of KEMET aluminum chips is not required.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
63
KEMET [ KEMET CORPORATION ]
