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IRFR4105ZTRL 参数 Datasheet PDF下载

IRFR4105ZTRL图片预览
型号: IRFR4105ZTRL
PDF下载: 下载PDF文件 查看货源
内容描述: 汽车级 [AUTOMOTIVE GRADE]
分类和应用:
文件页数/大小: 12 页 / 4675 K
品牌: KERSEMI [ Kersemi Electronic Co., Ltd. ]
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AUTOMOTIVE GRADE
AUIRFR4105Z
AUIRFU4105Z
V
(BR)DSS
R
DS(on)
max.
I
D
55V
24.5m
30A
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
D
G
S
Description
Specifically designed for Automotive applications,
this HEXFET
®
Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of this
design are a 175°C junction operating temperature,
fast switching speed and improved repetitive ava-
lanche rating . These features combine to make this
design an extremely efficient and reliable device for
use in Automotive applications and a wide variety of
other applications.
D
S
D-Pak
AUIRFR4105Z
G
D
G
I-Pak
AUIRFU4105Z
S
D
G
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (T
A
) is 25°C, unless otherwise specified.
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
E
AS
(tested )
I
AR
E
AR
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
Max.
30
21
120
48
0.32
± 20
29
46
See Fig.12a, 12b, 15, 16
-55 to + 175
Units
A
W
W/°C
V
mJ
A
mJ
°C
™
Ù
h
d
g
Thermal Resistance
R
θJC
R
θJA
R
θJA
300
10 lbf in (1.1N m)
y
y
Junction-to-Case
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
j
Parameter
Typ.
–––
–––
–––
Max.
3.12
50
110
Units
°C/W
i
www.kersemi.com
1
07/23/2010