PD - 96045
Applications
l
High Frequency Synchronous Buck
Converters for Computer Processor Power
l
High Frequency Isolated DC-DC
Converters with Synchronous Rectification
for Telecom and Industrial Use
l
Lead-Free
Benefits
l
Very Low R
DS(on)
at 4.5V V
GS
l
Ultra-Low Gate Impedance
l
Fully Characterized Avalanche Voltage
and Current
IRFR3707ZCPbF
IRFU3707ZCPbF
HEXFET
®
Power MOSFET
V
DSS
R
DS(on)
max
30V
9.5m
:
Qg
9.6nC
D-Pak
IRFR3707ZCPbF
I-Pak
IRFU3707ZCPbF
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 100°C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Max.
30
± 20
Units
V
A
f
39
f
56
220
50
25
0.33
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
W
-55 to + 175
300 (1.6mm from case)
W/°C
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
Typ.
Max.
3.0
50
110
Units
°C/W
gÃ
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www.kersemi.com
1
06/22/06
KERSEMI [ Kersemi Electronic Co., Ltd. ]
