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KB4863
Typical Performance Characteristics
MTE Specific Characteristics
(Continued)
KB4863MTE
(Note 17)
Power Derating Curve
Note 17:
This curve shows the KB4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions:
500LFPM + JEDEC board:
The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it.
Board information
- copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + 2.5in
2
:
The part is soldered to a 2.5in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2.5in
2
:
The part is soldered to a 2.5in
2
, 1oz. copper plane.
Not Attached:
The part is not soldered down and is not forced-air cooled.
Non-MTE Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Output Power
Rev: 1.1
6/19
2005-12-05
KINGBOR [ KINGBOR TECHNOLOGY CO ]
