DN(X)
diode terminator network
EU
features
•
•
•
•
Fast reverse recovery time
•
Fast turn on time
Low capacitance
•
SMD packages
16 kV IEC61000-4-2 capable
Products with lead-free terminations meet EU RoHS
and China RoHS requirements
circuit
protection
applications
•
Signal termination
•
Signal conditioning
dimensions and construction
S03
L
P
Bonding
Wire
Die
Pad
W
Molded
Resin
Si
Wafer
Lead
d
Molded
Resin
W
Die
Si Pad
Wafer
•
ESD suppression
•
Transient suppression
S04
L
p
Bonding
Wire
Lead
d
Package Total
Code Power
S03
S04
S06
N08
225mw
225mw
225mw
400mw
1000mw
1000mw
Pins
3
4
6
8
20
24
Dimensions
inches
(mm)
L ±0.2 W ±0.2 p ±0.1
Pkg Ht
d ±0.05
±0.2
.115
(2.92)
.115
(2.92)
.115
(2.92)
.190
(4.83)
.341
(8.66)
.341
(8.66)
.091
(2.30)
.091
(2.30)
.110
(2.80)
.236
(5.99)
.236
(5.99)
.236
(5.99)
.075
(1.91)
.075
(1.91)
.037
(0.95)
.050
(1.27)
.025
(0.635)
.025
(0.635)
.037
(0.95)
.037
(0.95)
.037
(0.95)
.063
(1.60)
.063
(1.60)
.063
(1.60)
.017
(0.43)
.017
(0.43)
.017
(0.43)
.016
(0.41)
.010
(0.25)
.010
(0.25)
S06
L
p
N08, Q20,
Q24
Bonding
Wire
Lead
L
Bonding
Wire
d
p
Lead
Q20
Q24
W
Si
Wafer
Molded
Resin
W
d
Die
Pad
Die
Pad
Si
Wafer
Molded
Resin
circuit schematic
1
1
DNA:
20 pins
DN2:
20 pins
1
DN3:
6 pins
1
DN4:
4 pins
1
DN5:
24 pins
1
DN6:
8 pins
1
DN7:
24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
200
KOA Speer Electronics, Inc.
• 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
KOA [ KOA SPEER ELECTRONICS, INC. ]
