KOA SPEER ELECTRONICS, INC.
SS-227 R2
8. Characteristics Cont.
Item
Terminal Adhesion
Strength
Requirement
No physical damage
Conditions
Solder a chip to a test
substrate and then
laterally apply a
load (5N, 500gF) in
the arrow direction.
Chip
Substrate
Soldering Heat
Resistance
Appearance:
No physical damage
Capacitance:
Within tolerance
Dielectric Loss:
Within tolerance
Insulation Resistance:
Within tolerance
Flux:
25% rosin
Pre-heating:
60 sec
Pre-heating Temp:
150°C
Solder:
H60A
Solder Temp:
260°C ±5°C
Dip Time:
5 ±0.5 sec
Flux:
25% rosin
Pre-heating:
60 sec
Pre-heating Temp:
150°C
Solder:
H60A
Solder Temp:
230°C ±5°C
Dip Time:
4 ±1 sec
Repeat the following heat cycle 10 times:
Step Temperature
Time
1
-40°C ±3°C
30 min ±3 min
2
Room Temp.
15 min max.
3
85°C ±2°C
30 min ±3 min
4
Room Temp.
15 min max.
Temp:
70°C ±2°C
Bias:
150% of rated voltage
Test Time:
1000+48/-0 hour
Solderablility
More than 95% of the terminal electrode shall
be covered with new solder.
Temperature Cycle
Appearance:
No physical damage
Capacitance:
Within tolerance
Dielectric Loss:
Within tolerance
Insulation Resistance:
Within tolerance
High Temperature
Resistance
Appearance:
No physical damage
Capacitance:
Within tolerance
Dielectric Loss:
Within tolerance
Insulation Resistance:
Within tolerance
Appearance:
No physical damage
Capacitance:
Within tolerance
Dielectric Loss:
Within tolerance
Insulation Resistance:
Within tolerance
Appearance:
No physical damage
Capacitance:
Within tolerance
Humidity Resistance
(unload)
Temp:
85°C ±2°C
Humidity:
85% ±5%
Test Time:
500+24/-0 hour
Vending Substrate
After soldering a chip to a test substrate,
bend the substrate by 1 mm and then measure.
The substrate is GE4
20
or based on GE4.
Substrate
Weight
Displacement
45
±
2
45
±
2
PAGE 5 OF 8
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.