ML145146
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOG = -6P
(MC145146-6P)
CASE 751D-04
-A-
20
11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONA AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006)
PER SIDE
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL, IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
INCHES
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
10.05
0.25
10.56
0.75
MILLIMETERS
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.020
0.035
.0395
0.010
0.415
0.029
-B-
P
10 PL
0.25 (0.010)
M
B
M
1
1
0
J
0.25 (0.010)
M
T B
S
A
S
F
R
X 45°
C
-T-
K
M
PLASTIC DIP
(MC145146RP)
CASE 738-03
-A-
20
11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982
2. CONTROLLING DIMENSION: INCH
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH
INCHES
MIN
MAX
1.010
1.070
0.240
.0260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0.51
1.01
B
1
1
0
C
L
-T-
SEATING
PLANE
K
M
E
G
F
D
20 PL
0.25 (0.010)
M
T A
M
N
J
20 PL
0.25 (0.010)
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
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ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
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