LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUY2040
Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
High Temperature
Storage Test
1.Ta=105
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
JIS C 7021: B-12
High Temperature
High Humidity Test
1.Ta=65
℃±
5
℃
2.RH=90%~95%
3.t=240hrs
±
2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
Thermal Shock Test
1.Ta=105
℃±
5
℃
&-40
℃±
5
℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
This test intended to see soldering well
performed or not.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260
℃±
5
℃
2.Dwell time= 10
±
1sec.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Solderability Test
1.T.Sol=230
℃±
5
℃
2.Dwell time=5
±
1sec
LIGITEK [ LIGITEK ELECTRONICS CO., LTD. ]
