Data Sheet
September 23, 2011
QBVW033A0B Series Power Modules; DC-DC Converters
36-75V
dc
Input; 12V
dc
Output; 33A Output Current
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Reflow Lead-Free Soldering
Information (continued)
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power
Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
If additional information is needed, please consult with
your Lineage Power representative for more details
Figure 24. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The QBVW033A0B modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
EMC Considerations
The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022
Class A. For further information on designing for EMC compliance, please refer to the FLTR100V10 data sheet.
Figure 25. EMC Considerations
LINEAGE
POWER
12
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
