LT1129/LT1129-3.3/LT1129-5
PACKAGE DESCRIPTIO
U
F Package
20-Lead Plastic TSSOP (4.4mm)
(LTC DWG # 05-08-1650)
6.40 – 6.60*
(.252 – .260)
1.05
±0.10
20 19 18 17 16 15 14 13 12 11
4.50
±0.10
6.40
(.252)
BSC
0.65 BSC
1 2 3 4 5 6 7 8 9 10
1.10
(.0433)
MAX
0° – 8°
0.25
REF
6.60
±0.10
0.45
±0.05
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50**
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.65
(.0256)
BSC
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
0.19 – 0.30
(.0075 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
F20 TSSOP 0204
OBSOLETE PACKAGE
112935fc
13
LINEAR [ LINEAR INTEGRATED SYSTEMS ]
