LTC2908
U
PACKAGE DESCRIPTIO
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702)
0.61 ±0.05
(2 SIDES)
0.675 ±0.05
2.50 ±0.05
1.15 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
2.20 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
0.38 ± 0.10
3.00 ±0.10
(2 SIDES)
TYP
5
8
0.56 ± 0.05
(2 SIDES)
2.00 ±0.10
PIN 1 BAR
(2 SIDES)
TOP MARK
PIN 1
(SEE NOTE 6)
CHAMFER OF
EXPOSED PAD
4
1
(DDB8) DFN 1103
0.25 ± 0.05
0.75 ±0.05
0.200 REF
0.50 BSC
2.15 ±0.05
(2 SIDES)
0 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
sn2908 2908fs
14
Linear Systems [ Linear Systems ]
