LTC2960
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DC8 Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev A)
R = 0.115
TYP
5
8
R = 0.05
0.70 0.05
TYP
0.40 0.10
2.55 0.05
1.15 0.05
2.00 0.10 0.64 0.10
(4 SIDES)
(2 SIDES)
0.64 0.05
(2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
PACKAGE
OUTLINE
CHAMFER
(DC8) DFN 0409 REVA
4
1
0.23 0.05
0.45 BSC
0.25 0.05
0.45 BSC
0.75 0.05
0.200 REF
1.37 0.10
(2 SIDES)
1.37 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A)
2.90 BSC
(NOTE 4)
0.40
MAX
0.65
REF
1.22 REF
1.50 – 1.75
(NOTE 4)
2.80 BSC
1.4 MIN
3.85 MAX 2.62 REF
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.22 – 0.36
8 PLCS (NOTE 3)
0.65 BSC
0.80 – 0.90
0.20 BSC
DATUM ‘A’
0.01 – 0.10
1.00 MAX
0.30 – 0.50 REF
1.95 BSC
TS8 TSOT-23 0710 REV A
0.09 – 0.20
(NOTE 3)
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
3. DIMENSIONS ARE INCLUSIVE OF PLATING 6. JEDEC PACKAGE REFERENCE IS MO-193
2960f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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