LTC3226
ELECTRICAL CHARACTERISTICS
SYMBOL
LDO
Minimum CPO Voltage for LDO Operation
V
LDO_FB
LDO FB Servo Voltage
Load Regulation ΔV
LDO_FB
/ΔI
OUT
LDO FET R
DS(ON)
I
LDO_FB(LEAK)
LDO_FB Input Leakage Current
I
LIM
RST_FB,
RST
V
RST_FB(TH)
V
RST_FB(HYS)
I
RST_FB(LEAK)
RST_FB Threshold (Falling Edge)
RST_FB Hysteresis
RST_FB Input Leakage Current
RST
Output Low Voltage
RST
High Impedance Leakage Current
RST
Delay (RST_FB Rising)
Power-Fail Comparator
V
PFI(TH)
V
PFI(HYS)
I
PFI(LEAK)
I
PFO(LEAK
)
EN_CHG
V
IH
V
IL
I
IH
I
IL
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C (Note 3). V
IN
= 3.3V, V
CPO
= 5V, V
OUT
= 3.3V, VMID = 1/2 V
CPO
unless
otherwise noted.
PARAMETER
CONDITIONS
MIN
2.4
I
VOUT
= 1mA
1mA < I
VOUT
< 2A
V
CPO
= 3.6V
V
LDO_FB
= 0.9V
l
l
TYP
MAX
UNITS
V
0.76
0.8
2.7
200
0.82
V
mV/A
mΩ
–60
2
0.72
–50
65
4
0.74
20
60
nA
A
LDO Current Limit
0.76
50
1
V
mV
nA
mV
µA
ms
V
RST_FB
= 0.9V
I
SINK
= 5mA
V
RST
= 5V
l
l
290
l
PFI Input Threshold (Falling Edge)
PFI input Hysteresis
PFI Input Leakage Current
PFO
Output Low Voltage
PFO
High Impedance Leakage Current
PFI Delay to
PFO
(PFI Falling)
V
PFI
= 0.5V
I
SINK
= 5mA
V
PFO
= 5V
1.175
–50
1.2
20
1.225
50
V
mV
nA
mV
µA
µs
V
l
65
l
1
0.5
1.3
0.4
–1
–1
1
1
V
µA
µA
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much greater than
58.7°C/W.
Note 3:
The LTC3226E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specifications over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3226I is guaranteed over the full –40°C to 125°C operating junction
temperature range. The junction temperature, T
J
, is calculated from the
ambient temperature, T
A
, and power dissipation, P
D
, according to the
formula:
T
J
= T
A
+ (P
D
• 58.7°C/W)
Note that the maximum ambient temperature, consistent with these
specifications, is determined by specific operating conditions in
conjunction with board layout, the rated thermal package thermal
resistance and the environmental factor.
Note 4:
Output not in regulation; R
OL
= (2 • V
IN
– V
CPO
)/I
CPO
.
3226f
4
LINEAR [ LINEAR INTEGRATED SYSTEMS ]
