LTC4071
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
0.61 0.05
(2 SIDES)
R = 0.115
0.40 ± 0.10
3.00 0.10
(2 SIDES)
TYP
5
R = 0.05
8
TYP
0.70 0.05
2.55 0.05
2.00 ±0.10
(2 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
1.15 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
PACKAGE
OUTLINE
0.56 ± 0.05
(2 SIDES)
4
1
(DDB8) DFN 0905 REV B
0.25 0.05
0.25 0.05
0.75 ±0.05
0.200 REF
0.50 BSC
2.20 0.05
(2 SIDES)
0.50 BSC
2.15 ±0.05
(2 SIDES)
0 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
4071fc
15
Linear Systems [ Linear Systems ]
