LT1111
U
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTIO
J8 Package
8-Lead Ceramic DIP
0.405
(10.287)
MAX
CORNER LEADS OPTION
(4 PLCS)
0.005
(0.127)
MIN
0.200
(5.080)
MAX
0.290 – 0.320
(7.366 – 8.128)
6
5
4
8
7
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.015 – 0.060
(0.381 – 1.524)
0.025
(0.635)
RAD TYP
0.220 – 0.310
(5.588 – 7.874)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
1
2
3
0.045 – 0.068
(1.143 – 1.727)
0.385 ± 0.025
(9.779 ± 0.635)
0.125
3.175
MIN
0.100 ± 0.010
0.014 – 0.026
(2.540 ± 0.254)
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
N8 Package
8-Lead Plastic DIP
0.400
(10.160)
MAX
0.130 ± 0.005
0.045 – 0.065
0.300 – 0.320
(3.302 ± 0.127)
(1.143 – 1.651)
(7.620 – 8.128)
8
1
7
6
5
0.065
(1.651)
TYP
0.250 ± 0.010
(6.350 ± 0.254)
0.009 – 0.015
(0.229 – 0.381)
0.125
0.020
(0.508)
MIN
(3.175)
MIN
+0.025
–0.015
0.045 ± 0.015
(1.143 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
2
4
3
0.325
+0.635
8.255
(
)
–0.381
0.018 ± 0.003
(0.457 ± 0.076)
S8 Package
8-Lead Plastic SOIC
0.189 – 0.197
(4.801 – 5.004)
0.010 – 0.020
(0.254 – 0.508)
7
5
8
6
× 45°
0.004 – 0.010
(0.101 – 0.254)
0.053 – 0.069
(1.346 – 1.752)
0.008 – 0.010
(0.203 – 0.254)
0°– 8° TYP
0.150 – 0.157
(3.810 – 3.988)
0.228 – 0.244
(5.791 – 6.197)
0.016 – 0.050
0.406 – 1.270
0.050
(1.270)
BSC
0.014 – 0.019
(0.355 – 0.483)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
1
3
4
2
SO8 0294
LT/GP 0594 5K REV C • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1994
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7487
16
●
●
(408) 432-1900 FAX: (408) 434-0507 TELEX: 499-3977
Linear [ Linear ]
