LT1308A/ LT1308B
U
W U U
APPLICATIONS INFORMATION
LBI
LBO
GROUND PLANE
C2
4.7µF
CERAMIC
L1A
CTX10-2
C1
D1
V
3V TO
10V
IN
+
V
IN
V
IN
SW
+
L1B
C1
R1
47µF
1
2
3
4
8
7
6
5
R1
309k
LT1308B
V
OUT
5V
500mA
SHUTDOWN
SHDN
FB
GND
LT1308A
LT1308B
L1
R2
V
C
SHUTDOWN
R2
100k
+
C3
220µF
47k
680pF
6.3V
MULTIPLE
VIAs
+
D1
C2
GND
C1: AVX TAJC476M016
C2: TAIYO YUDEN EMK325BJ475(X5R)
C3: AVX TPSD227M006
D1: IR 10BQ015
L1: COILTRONICS CTX10-2
1308A/B F05
V
OUT
Figure 5. SEPIC (Single-Ended Primary
Inductance Converter) Converts 3V to 10V
Input to a 5V/500mA Regulated Output
1308 F04
Figure 4. Recommended Component Placement for Boost
Converter. Note Direct High Current Paths Using Wide PC
Traces. Minimize Trace Area at Pin 1 (V ) and Pin 2 (FB).
C
Use Multiple Vias to Tie Pin 4 Copper to Ground Plane. Use
Vias at One Location Only to Avoid Introducing Switching
Currents into the Ground Plane
LBI
LBO
GROUND PLANE
C1
+
V
IN
R1
1
2
8
7
6
5
LT1308A
LT1308B
R2
SHUTDOWN
3
4
L1A
C2
L1B
MULTIPLE
VIAs
C3
+
GND
D1
V
OUT
1308 F06
Figure 6. Recommended Component Placement for SEPIC
8