LT1937
PACKAGE DESCRIPTIO
0.62
MAX
3.85 MAX 2.62 REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
1.00 MAX
DATUM ‘A’
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
0.09 – 0.20
(NOTE 3)
0.47
MAX
0.65
REF
3.26 MAX 2.1 REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.10 – 0.40
0.10 – 0.30
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
0.10 – 0.18
(NOTE 3)
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.95
REF
2.90 BSC
(NOTE 4)
1.22 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.01 – 0.10
1.90 BSC
S5 TSOT-23 0302
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638)
1.80 – 2.20
(NOTE 4)
1.16 REF
0.96 MIN
1.80 – 2.40 1.15 – 1.35
(NOTE 4)
INDEX AREA
(NOTE 6)
PIN 1
0.65 BSC
0.15 – 0.30
6 PLCS (NOTE 3)
0.80 – 1.00
0.00 – 0.10
1.00 MAX
SC6 SC70 0302
1937f
11
LINER [ LINEAR TECHNOLOGY ]
