LTC3202
PACKAGE DESCRIPTIO
U
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889
±
0.127
(.035
±
.005)
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
10 9 8 7 6
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
0.50
0.305
±
0.038
(.0197)
(.0120
±
.0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
1 2 3 4 5
0.53
±
0.152
(.021
±
.006)
DETAIL “A”
0.18
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.127
±
0.076
(.005
±
.003)
MSOP (MS) 0603
0.497
±
0.076
(.0196
±
.003)
REF
DETAIL “A”
0° – 6° TYP
4.90
±
0.152
(.193
±
.006)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
1.10
(.043)
MAX
0.86
(.034)
REF
0.50
(.0197)
BSC
DD Package
10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
TYP
6
0.55
±0.05
0.38
±
0.10
10
3.35
±0.05
1.65
±0.05
2.25
±0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25
±
0.05
0.50
BSC
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
PIN 1
TOP MARK
3.00
±0.10
(4 SIDES)
1.65
±
0.10
(2 SIDES)
(DD10) DFN 0103
5
0.200 REF
0.75
±0.05
2.38
±0.10
(2 SIDES)
1
0.25
±
0.05
0.50 BSC
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
3202fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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