LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Absolute Maximum Ratings at T =25℃
A
Parameter
Maximum Rating
135
Unit
mW
Power Dissipation
Peak Forward Current
100
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
30
0.5
5
mA
mA/℃
V
Derating Linear From 30℃
Reverse Voltage
Electrostatic Discharge Threshold(HBM) Note A
Operating Temperature Range
1000
V
-20℃ to + 80℃
Storage Temperature Range
-30℃ to + 100℃
Lead Soldering Temperature
[1.6mm(.063") From Body]
260℃ for 5 Seconds
Note A :
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid
avalanche test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown.
The RAET procedure is performed on each die. The ESD classification of Class II is based on sample testing according to
MIL-STD 883E. (From CREE official DS).
Part No. : LTL2R3CBK5
BNS-OD-C131/A4
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