LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
Chip ESD level
InGaN / Sapphire
AlInGaP
Machine Mode
100 V
Human Body Mode
300 V
200 V
500 V
InGaN / SiC
600 V
1000 V
7. Reliability Test
Classification
Test Item
Test Condition
Reference Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
Operation Life
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90〜95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance
Test
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
High Temperature
Storage
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
Low Temperature
Storage
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
105℃ 〜 25℃ 〜 -55℃ 〜 25℃
Temperature
Cycling
30mins 5mins
10 Cycles
30mins 5mins
IR-Reflow In-Board, 2 Times
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Thermal
Shock
85 ± 5℃ 〜 -40℃ ± 5℃
10mins
10mins 10 Cycles
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
T.sol= 260 ± 5℃
Solder
Resistance
Dwell Time= 10 ± 1secs
Environmental
Test
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
IR-Reflow
Ramp-down rate +6℃/second max
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Solderability
Immersion rate 25±2.5 mm/sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
Part No. : LTSN-C190QF
BNS-OD-C131/A4
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