Introduction to & Cartridge Fuses
Axial Lead Circuit Protection
2AG > Time Lag > Transientology
229/230 Series
Average Time Current Curves
Temperature Rerating Curve
1000
100
TIME IN SECONDS
10
1
0.1
0.01
0.1
1
10
100
CURRENT IN AMPERES
1000
Soldering Parameters - Wave Soldering
300
Temperature (°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Process Parameters:
Wave Parameter
Preheat:
100
°
C
150
°
C
Solder Pot Temperature:
Solder Dwell Time:
260
°
Lead-Free Recommendation
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Hand-Solder Parameters:
Note: These devices are not recommended for IR or
Convection Reflow process.
.250A
.375A
.500A
.750A
1.00A
1.50A
2.0A
2 .5A
3.0A
3.5A
4A
5A
7A
229/230 Series
262
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/229.html
or /230.html for current information.
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