Surface Mount Fuses
Thin Film > 1206 Size > Very Fast Acting > 433 Series
Temperature Rerating Curve
AverageTime Current Curves
100
10
1
0.1
0.01
0.001
0.1
1
10
100
CURRENT IN AMPERES
Soldering Parameters -Wave Soldering
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
)
150°C
Pre Heat -Temperature Max (Ts(max)
-Time (Min to Max) (ts)
)
200°C
60 – 180 secs
Average ramp up rate (LiquidusTemp
(TL) to peak
5°C/second max
TS(max) toTL - Ramp-up Rate
5°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
-Temperature (tL)
60 – 150 seconds
250+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
8 minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
©2008 Littelfuse, Inc.
8
433 Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for the most current information
Revision: February 13, 2008
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