Surface Mount Fuses
Introduction to Circuit Protection
®
NANO2® > Slo-Blo > 452/454 Series
Transientology
Temperature Rerating Curve
AverageTime Current Curves
100
10
1
Note:
ꢇꢋꢀ %FSBUJOHꢀEFQJDUFEꢀJOꢀUIJTꢀDVSWFꢀJTꢀJOꢀBEEJUJPOꢀUPꢀUIFꢀTUBOEBSEꢀEFSBUJOHꢀPGꢀꢈꢆꢊꢀGPSꢀ
continuous operation.
0.1
0.01
0.1
1
10
100
1000
CURRENT IN AMPS
Soldering Parameters
tP
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
TP
Critical Zone
TL to TP
Ramp-up
)
ꢇꢆꢉ¡$ꢀ
TL
Pre Heat -Temperature Max (Ts(max)
-Time (Min to Max) (ts)
)
ꢈꢉꢉ¡$
tL
TS(max)
60 – 120 secs
Ramp-down
Average ramp up rate (LiquidusTemp
(TL) to peak
Preheat
ꢆ¡$ꢎTFDPOEꢀNBYꢋ
TS(min)
tS
TS(max) toTL - Ramp-up Rate
ꢆ¡$ꢎTFDPOEꢀNBYꢋ
ꢈꢇꢅ¡$ꢀ
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
(t 25ºC to peak)
-Temperature (tL)
60 – 90 seconds
ꢈꢆꢉꢔꢉꢎꢁꢆꢀ¡$
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
ꢆ¡$ꢎTFDPOEꢀNBYꢋ
8 minutes max.
ꢈꢐꢉ¡$
Time 25°C to peakTemperature (TP)
Do not exceed
ꢈꢐꢉ¡$ꢀ1FBLꢀ
Temperature,
ꢄꢀTFDPOETꢀNBYꢋ
Wave Soldering Parameters
© 2009 Littelfuse, Inc.
452/454 Series
62
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/452.html
or /454.html for current information.
LITTELFUSE [ LITTELFUSE ]
