Surface Mount Fuses
Introduction to Circuit Protection
Transientology
NANO
2®
> Slo-Blo
®
> 452/454 Series
Temperature Rerating Curve
Average Time Current Curves
3.00A
2.50A
2.00A
1.50A
1.00A
750mA
500mA
375mA
12.0A
8.00A
7.00A
5.00A
4.00A
3.50A
100
TIME IN SECONDS
Note:
continuous operation.
10
1
0.1
0.01
0.1
1
10
100
1000
CURRENT IN AMPS
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
60 – 90 seconds
60 – 120 secs
Pb – Free assembly
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
Temperature
Pre Heat
- Temperature Max (T
s(max)
)
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Wave Soldering Parameters
Temperature,
8 minutes max.
20 – 40 seconds
452/454 Series
62
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/452.html
or /454.html for current information.
LITTELFUSE [ LITTELFUSE ]
