Surface Mount Fuses
Introduction to Circuit Protection
Transientology
Surge Resistant > 461 Series TeleLink
®
Fuse
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
- Time (Min to Max) (t
s
)
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
Temperature
Pre Heat
- Temperature Max (T
s(max)
)
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Product Characteristics
Materials
Product Marking
Operating
Temperature
Moisture Sensitivity
Level
Solderability
Resistance to
Dissolution of
Metallization
Mechanical Shock
High Frequency
Vibration
Moisture Resistance
Terminal Strength
Terminal Attachment
Body:
Terminations:
Thermal Shock
Part Numbering System
0461 1.25 E R
SERIES
AMP Code
*
QUANTITY Code
PACKAGING Code
*Example:
002.ER
Packaging
Packaging Option
Packaging Specification
Quantity
Quantity &
Packaging Code
ER
461 Series
88
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/461.html for current information.
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