Surface Mount Fuses
Introduction to Circuit Protection
Transientology
NANO
2®
> 250V vvUMF > Fast-Acting > 464 Series
Temperature Rerating Curve
Average Time Current Curves
.80 A
1.00 A
1.25 A
1.60 A
2.00 A
2.50 A
3.15 A
4.00 A
5.00 A
6.30 A
.50 A
100
10
TIME IN SECONDS
1
0.1
0.01
0.001
0.1
1
100
10
CURRENT IN AMPERES
1000
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
Temperature
Pre Heat
- Temperature Max (T
s(max)
)
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Wave Soldering Parameters
464 Series
78
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/464.html for current information.
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