Transient Voltage Suppression Diodes
Surface Mount – 600W > SMBJ series
Soldering Parameters
Reflow Condition
T
P
t
p
Ramp-up
Critical Zone
T
L
to T
P
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Time (min to max) (t
s
)
150°C
200°C
Temperature (T)
T
L
T
s(max)
t
L
3°C/second max
3°C/second max
217°C
260
+0/-5
°C
Ramp-down
T
s(min)
t
s
Preheat
25˚C
t 25˚C to Peak
Time (t)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
6°C/second max
8 minutes Max.
280°C
Physical Specifications
Weight
Case
Polarity
Terminal
0.003 ounce, 0.093 grams
JEDEC DO214AA. Molded plastic body
over glass passivated junction
Color band denotes cathode except
Bidirectional
Matte Tin-plated leads, Solderable per
JESD22-B102D
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
SMBJ Series
26
Revision: January 09, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMBJ.html for current information.
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