Surface Mount – 1500W > SMCJ series
Transient Voltage Suppression Diodes
Soldering Parameters
Reflow Condition
T
P
t
p
Ramp-up
Critical Zone
T
L
to T
P
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Time (min to max) (t
s
)
150°C
200°C
Temperature (T)
T
L
T
s(max)
t
L
Ramp-down
T
s(min)
t
s
Preheat
217°C
260
°C
25˚C
t 25˚C to Peak
Time (t)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Physical Specifications
Weight
Case
Color band denotes positive end
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
Polarity
Terminal
Dimensions
DO-214AB (SMC J-Bend)
Dimensions
Cathode Band
Inches
Min
0.114
0.260
0.220
Max
0.126
Millimeters
Min
Max
A
A
C
C
6.600
0.245
2.060
0.060
0.760
7
.750
7
.110
6.220
2.620
1.520
B
H
D
F
E
J
0.006
I
0.012
0.152
2.400
G
K
L
0.165
4.200
2.400
I
SMCJ Series
Revision: November 13, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMCJ.html for current information.
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