Electrical Characteristics at 350mA, Junction Temperature, T
J
= 25ºC,
Continued
Table 7.
Part Number
LXHL MWGC
LXHL NWG8
Forward Voltage V
F
(V)
Min.
Typ.
Max.
2.79
2.79
3.42
3.42
3.99
3.99
[1]
Dynamic
Resistance
(
Ω
) R
D
1.0
1.0
[2]
Temperature Coefficient
of Forward Voltage
[3]
(mV/ºC)
Δ
V
F
/
Δ
T
J
2.0
2.0
Thermal Resistance,
Junction to Case
(ºC/W) R
θ
J B
20
20
Notes for Table 7:
1. Philips Lumileds maintains a tolerance of ± 0.06V on forward voltage measurements.
2. Dynamic resistance is the inverse of the slope in linear forward voltage model for LEDs. See Figures 3a and 3b.
3. Measured between 25°C
≤
T
J
≤
110°C at I
F
= 350mA.
Absolute Maximum Ratings
Table 8.
Emitter
350
500
350
Parameter
DC Forward Current (mA)
[1]
LXHL BW03
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
[2]
± 16,000V HBM
120
40 to +120
[3]
LED Junction Temperature (°C)
Storage Temperature (°C)
Soldering Temperature (°C)
260 for 5 seconds max
Absolute Maximum Ratings
Table 9.
Star Products
LXHL NWG8
350
500
350
± 16,000V HBM
120
105
40 to +75
Parameter
DC Forward Current (mA)
[1]
LXHL MWGC
350
500
350
± 16,000V HBM
120
[4]
[5]
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
[2]
LED Junction Temperature (°C)
AluminumCore PCB Temperature (°C)
Storage & Operating Temperature (°C)
105
40 to +105
Notes for Tables 8 & 9:
1. Proper current derating must be observed to maintain junction temperature below the maximum. For more information,
consult the LUXEON Design Guide, available upon request.
2. LEDs are not designed to be driven in reverse bias. Please consult Philips Lumileds application brief AB11 for
further information.
3. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120°C. LUXEON emitters
cannot be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective
heating of the leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may
not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and
the board is required. Please consult Philips Lumileds Application Brief AB10 on
LUXEON Emitter Assembly Information
for
further details on assembly methods.
4. Allowable MCPCB temperature to avoid exceeding maximum junction temperature at maximum V
f
limit based on thermal
resistance of Star assembly.
5. A reduction in maximum storage and operating temperature is required due to the acrylic optic.
LUXEON Warm White Emitter & Star DS47 (7/06)
7
LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
