Reflow Soldering Characteristics
JEDEC 020c
Table 7.
Profile Feature
Average Ramp-Up Rate (Ts
max
to T
p
)
Preheat Temperature Min (Ts
min
)
Preheat Temperature Max (Ts
max
)
Preheat Time (ts
min
to ts
max
)
Temperature T
L
(t
L
)
Time Maintained Above Temperature T
L
(t
L
)
Peak / Classification Temperature (T
P
)
Time Within 5°C of Actual Peak Temperature (t
P
)
Ramp-Down Rate
Time 25°C to Peak Temperature
Note for Table 7:
Lead Free Assembly
3°C / second max
150°C
200°C
60 - 180 seconds
217°C
60 - 150 seconds
260°C
20 - 40 seconds
6°C / second max
8 minutes max
- All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
LUXEON Rebel Color Porfolio Datasheet DS68 20110819
9
LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
