Reflow Soldering Characteristics
JEDEC 020c
Table 7.
Profile Feature
Lead Free Assembly
3°C / second max
150°C
Average Ramp-Up Rate (Tsmax toTp)
PreheatTemperature Min (Tsmin
)
PreheatTemperature Max (Tsmax
)
200°C
PreheatTime (tsmin to tsmax
)
60 - 180 seconds
217°C
Temperature TL (tL)
Time Maintained Above TemperatureTL (tL)
Peak / ClassificationTemperature (TP)
Time Within 5°C of Actual PeakTemperature (tP)
Ramp-Down Rate
60 - 150 seconds
260°C
20 - 40 seconds
6°C / second max
8 minutes max
Time 25°C to PeakTemperature
Note forTable 7:
- All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
LUXEON Rebel Color Porfolio Datasheet DS68 20110819
9
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