Reflow Soldering Characteristics
300
T
p
: 260°C
250
T
L
: 217°C
200
Ramp-Up Rate, 3°C/sec. max.
260°C +0/-5°C
255°C +5/-0°C
Temperature ( C)
T
smax
: 200°C
t
p
: 10-30sec. 30sec max.
150
T
smin
: 150°C
t
s
: 60-120sec.
100
t
L
: 60-150 sec,max
50
0
0
50
100
150
200
250
300
Time (seconds)
Temperature profile for Table 6.
Table 6. Reflow Profile in Accordance with J-Std-020D.
Profile Feature
Preheat/Soak :
Temperature Min (T
smin
)
Temperature Max (T
smax
)
Maximum Time (t
s
) from T
smin
to T
smax
Ramp-up Rate (T
L
to T
p
)
Liquidous Temperature (T
L
)
Maximum Time (t
L
) Maintained above T
L
Maximum Peak Package Body Temperature (T
p
)
Time (t
p
) within 5°C of the specified temperature (T
c
)
Maximum Ramp-Down Rate (T
p
to T
L
)
Maximum Time 25°C to Peak Temperature
Note for Table 6:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Lead Free Assembly
150°C
200°C
120 seconds
3°C / second
217°C
150 seconds
260°C
10-30 seconds
6°C / second
8 minutes
LUXEON 3535 2D Datasheet DS204 20130530 ©2013 Philips Lumileds Lighting Company.
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