IM Relay
General data
Operate time at
U
nom
typ. / max.
Reset time (latching) at
U
nom
, typ. / max.
Release time without diode in parallel (non-latching), typ. / max.
Release time with diode in parallel (non-latching), typ. / max.
Bounce time at closing contact, typ. / max.
Maximum switching rate without load
Ambient temperature
Thermal resistance
Maximum permissible coil temperature
Vibration resistance (function)
Shock resistance, half sinus, 11 ms
half sinus, 0.5 ms
Degree of protection
Needle flame test
Mounting position
Processing information
Weight (mass)
Resistance to soldering heat
All data refers to 23° C unless otherwise specified.
1 ms / 3 ms
1 ms /3 ms
1 ms / 3 ms
3 ms / 5 ms
1 ms / 5 ms
50 operations/s
-40° C ... +85° C
< 150 K/W
125° C
20 G
10 to 1000 Hz
50 G (function)
500 G (damage)
immersion cleanable, IP 67
application time 20 s, no burning and glowing
any
Ultrasonic cleaning is not recommended
max. 0.75 g
260° C / 10 s
Recommended soldering conditions
Soldering conditions according CECC 00802
10 sec
20 - 40 sec
215° C
Temperature °C
180° C
130° C
external preheating
Full line:
typical
Dotted line: process limits
max. 245° C
215° C
180° C
Temperature °C
ca. 40 sec
100° C
forced
cooling
130° C
Full line:
typical
Dotted line: process limits
Time (s)
Time (s)
Vapor Phase Soldering: Temperature/Time Profile
(Lead Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead Temperature)
6
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