Mezalok Connector
KEY FEATURES
DESCRIPTION
Rugged surface mount mezzanine connector incorporating “super-redundant”
Mini-Box contact system for separable interface.
60 and 114 positions
Designed for 10mm and 12mm stack heights in both 60 and 114 positions.
Mini-Box contact system
provides 4 points of
APPLICATIONS
Stacking or mezzanine applications
contact for ultra reliability
114 position is designed to support VITA 61 XMC architecture as rugged
alternative to VITA 42 XMC
LCP plastic housings offer
superior thermal stability
and are low-outgassing
60 position designed for custom architecture stacking applications
ELECTRICAL
Stacking or mezzanine applications
Compliant BGA board
attach supports standard
surface mount processing
and excellent thermal
stability
114 position is designed to support VITA 61 XMC architecture as rugged
alternative to VITA 42 XMC
60 position designed for custom architecture stacking applications
MECHANICAL
500 mating cycles durability
Mating force: 0.30 lb. max. times number of contacts
-65˚C to +125˚C operating temperature
Shock and vibration per VITA 47 requirements
114 position footprint
compatible to XMC foot-
print and all dimensional
constraints
MATERIALS
Pin Assembly:
Socket Assembly: LCP plastic housings, white in color
Contacts: High Performance Copper Alloy, 50µ” Au in mating interface
LCP plastic housings, white in color
(Sn/Pb and SAC305 solder balls are available)
STANDARDS & SPECS
114 position conforms to requirement of VITA 61 (VITA 42 Alternate)
VITA 42 and VITA 61 are not intermateable, but are footprint and XMC
architecture compatible
APPLICATION TOOLING
Product is installed via standard BGA surface mount processes.
Tyco Electronics I Mezalok