AMPMODU Interconnection System
Mod. IV Receptacle Assemblies, Double-Row,
.100 x .100 [2.54 x 2.54] Centerline
Closed Dual Entry, Side and
End Stackable Low Profile,
.100 x .100 [2.54 x 2.54]
Centerline, .150 [3.81] Tine
Spacing
.020
[0.51]
Typ.
(Standoffs)
.245
[6.22]
Typ.
A
.050
[1.27]
Max.
Typ.
Material and Finish
Housing
— Glass-filled thermoplastic,
black, 94V-0 rated
Contacts
— Phosphor bronze,
plated as follows:
Plating A
— Duplex .000030 [0.00076]
gold on contact area, .000150-.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B
— Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C
— .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
.198
[5.03]
.100±.003
[2.54±0.08]
.148
[3.77]
Typ.
Point of
Contact
.150
[3.81]
Typ.
.100
[2.54]
B
.075
+.005
-.000
.060
+0.13
1.90
-0.00
Dia.
.100*
[2.54]
Typ.
.107
[2.72]
Typ.
(Localized Gold
Plate Area)
B
.100
[2.54]
Typ.
.100
[2.54]
Typ.
.130±.010
[3.30±0.25]
Typ.
Vertical Mount,
Receptacle Assemblies
[
]
Typ.
Related Product Data
Mateable Headers
—
Refer to the Mating Post Selection
Guide — page 90
Performance Characteristics
—
page 174
Recommended PC Board Hole Layout
for Bottom Entry or Pass Through Applications
*±.003 [±0.08] tolerances not to accumulate
within one connector pattern.
No. of
Pos.
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Dimensions
A
B
.100
[2.54]
—
.200
[5.08]
.100
[2.54]
.300
[7.62]
.200
[5.08]
.400
[10.16]
.300
[7.62]
.500
[12.70]
.400
[10.16]
.600
[15.24]
.500
[12.70]
.700
[17.78]
.600
[15.24]
.800
[20.32]
.700
[17.78]
.900
[22.86]
.800
[20.32]
1.000
[25.40]
.900
[22.86]
1.100
[27.94]
1.000
[25.40]
1.200
[30.48]
1.100
[27.94]
1.300
[33.02]
1.200
[30.48]
1.400
[35.56]
1.300
[33.02]
1.500
[38.10]
1.400
[35.56]
1.600
[40.64]
1.500
[38.10]
1.700
[43.18]
1.600
[40.64]
1.800
[45.72]
1.700
[43.18]
1.900
[48.26]
1.800
[45.72]
2.000
[50.80]
1.900
[48.26]
.035±.003
Dia. Typ.
[0.89±0.08]
.150
[3.81]
Typ.
Recommended PC Board Hole Layout
for Top Entry
Contact Plating/Part Nos.
Plating B
5-147095-1
5-147095-2
5-147095-3
5-147095-4
5-147095-5
5-147095-6
5-147095-7
5-147095-8
5-147095-9
6-147095-0
6-147095-1
6-147095-2
6-147095-3
6-147095-4
6-147095-5
6-147095-6
6-147095-7
6-147095-8
6-147095-9
7-147095-0
5
Technical Documents
— page 276
Product Specification
108-25022
Application Specification
114-25018
Plating A
5-535542-1
5-535542-2
5-535542-3
5-535542-4
5-535542-5
5-535542-6
5-535542-7
5-535542-8
5-535542-9
6-535542-0
6-535542-1
6-535542-2
6-535542-3
6-535542-4
6-535542-5
6-535542-6
6-535542-7
6-535542-8
6-535542-9
7-535542-0
Plating C
5-147096-1
5-147096-2
5-147096-3
5-147096-4
5-147096-5
5-147096-6
5-147096-7
5-147096-8
5-147096-9
6-147096-0
6-147096-1
6-147096-2
6-147096-3
6-147096-4
6-147096-5
6-147096-6
6-147096-7
6-147096-8
6-147096-9
7-147096-0
Note:
All part numbers are RoHS
compliant.
Notes:
1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
the maximum point-of-contact dimension, and .062 [1.57] for recommended board thickness if used in bot-
tom entry application.
183
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
MACOM [ Tyco Electronics ]
