TOSHIBA
TB62734FMG
TOSHIBA BiCD Digital Silicon Monolithic Integrated Circuit
TB62734FMG
Step Up Type DC – DC Converter for White LED
Features
TB62734FMG is the high efficient STEP-UP type
DC/DC converter by which the optimal design was
carried out at constant current driver of white LED.
It is possible to drive 2 ~ 6 white LEDs which connected
in series by the lithium ion battery. This IC contains the
Nch-MOS transistor required for switching of external inductor.
The forward current of LED is set up by the external
resistor. As the brightness control function, an analog
voltage input and a pulse input system (PWM) are possible.
The switching frequency is fixed at around 1.0Mhz.
This IC is the most suitable as a driver of white LED back
lighting of the color LCD in the PDA, the cellular phone
and the handy terminal machine.
Characteristics
Brightness control function : LED forward current 30~100%
Maximum output voltage : over 26V
Variable of the LED current by external resistance
20mA(TYP.) @ RSENS=7.5Ω
Output power : 500 mW
Package : SON8-P-0.65 (Typical Height : 0.8mm)
High efficiency : 85% (Recommended parts in use)
Low resistance power MOS include
Ron=0.7Ω(TYP.) @ Vin=2.8~5.5V
Over voltage detection includes
Protection Voltage : OVD pin =20V (TYP.)
TB62734FMG
SON8-P-0.65
Weight : 0.016g (Typical)
VCC
K
B36
B
RSENS
GND
PGND
CTL
OVD
A
2
6
Note 1) This IC has the terminal (3 pin : HBM spec <
±1.5kV)
which is marginal
for ESD. The careful caution must be required for all handling stage.
And also, this device must be assembled in correct position, in case of
Assembled in the wrong direction, this IC might be destroyed.
Note 2) In case the control pin is open, unstable operation of the output should be caused.
Therefore, this control terminal must be fixed to the certain logic level.
Note 3) About solder ability, following conditions were confirmed
•Solder
ability
(1)Use of Sn-63Pd solder Bath
solder bath temperature = 230°C, dipping time = 5 seconds, the number of times = once, use of R-type flux
(2)Use of Sn-3.0Ag-0.5Cu solder Bath
solder bath temperature = 245°C, dipping time = 5 seconds, the number of times = once, use of R-type flux
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