TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)50T(F)
Maximum Ratings
(Ta
=
25°C)
Product Name
TLRE50T(F)
TLRME50T(F)
TLSE50T(F)
TLOE50T(F)
TLYE50T(F)
TLPYE50T(F)
TLGE50T(F)
TLFGE50T(F)
TLPGE50T(F)
Forward Current
I
F
(mA)
50
50
50
50
50
50
50
50
50
Reverse Voltage
V
R
(V)
4
4
4
4
4
4
4
4
4
Power Dissipation
P
D
(mW)
120
120
120
120
120
120
120
120
120
Operating
Temperature
T
opr
(°C)
Storage
Temperature
T
stg
(°C)
−
40~100
−
40~120
Electrical and Optical Characteristics
(Ta
=
25°C)
Product Name
TLRE50T(F)
TLRME50T(F)
TLSE50T(F)
TLOE50T(F)
TLYE50T(F)
TLPYE50T(F)
TLGE50T(F)
TLFGE50T(F)
TLPGE50T(F)
Unit
Typ. Emission Wavelength
λ
d
630
626
613
605
587
580
571
565
558
λ
P
(644)
(636)
(623)
(612)
(590)
(583)
(574)
(568)
(562)
nm
∆λ
20
23
20
20
17
14
17
15
14
I
F
20
20
20
20
20
20
20
20
20
mA
Luminous Intensity
I
V
Min
Typ.
I
F
850
850
1530
1530
1530
850
476
272
153
mcd
1800
2200
3500
4500
3500
2500
1500
1000
600
20
20
20
20
20
20
20
20
20
mA
Forward Voltage
V
F
Typ.
Max
I
F
1.9
1.9
1.9
2.0
2.0
2.0
2.0
2.0
2.1
V
2.4
2.4
2.4
2.4
2.4
2.4
2.4
2.4
2.4
20
20
20
20
20
20
20
20
20
mA
Reverse Current
I
R
Max
V
R
50
50
50
50
50
50
50
50
50
4
4
4
4
4
4
4
4
4
V
µ
A
Precautions
Please be careful of the following:
•
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 2 mm from the body of the device)
•
•
If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
2
2005-09-13
MARKTECH [ MARKTECH CORPORATE ]
