88F6180
Hardware Specifications
9
Thermal Data (Preliminary)
Table 59 provides the package thermal data for the device. This data is derived from simulations that
were run according to the JEDEC standard.
The thermal parameters are preliminary and subject to change.
Note
TET
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell products. Before
designing a system it is recommended to refer to these documents:
Application Note, AN-63 Thermal Management for Selected Marvell® Products, Document
Number MV-S300281-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Document Number
MV-S700019-00.
Table 59: Thermal Data for the 88F6180 in the 225-pin LFBGA Package (Preliminary)
Symbol
Definition
Airflow Value (C/W)
0[m/s]
27.8
1[m/s]
25.4
2[m/s]
24.7
θ
Thermal resistance: junction to ambient.
JA
Ψ
Thermal characterization parameter:
junction to case center.
3.2
3.4
3.5
JT
θ
Thermal resistance: junction to case (not air-flow dependent)
10.7
15.7
JC
Ψ
Thermal characterization parameter:
junction to the bottom of the package.
15.8
15.6
JB
θJB
Thermal resistance:
junction to the bottom of the package (not air-flow dependent)
15.9
Doc. No. MV-S104988-U0 Rev. E
Page 100
Copyright © 2008 Marvell
Document Classification: Proprietary Information
December 2, 2008, Preliminary
MARVELL [ MARVELL TECHNOLOGY GROUP LTD. ]
