MV78100
Hardware Specifications
10 Thermal Data (Preliminary)
Table 61 provides the package thermal data for the MV78100. This data is derived from simulations
that were run according to the JEDEC standard.
The thermal parameters are preliminary and subject to change.
Note
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell® products. Before
designing a system it is recommended to refer to these documents:
Application Note, AN-63 Thermal Management for Selected Marvell® Products (Doc. No.
MV-S300281-00)
White Paper, ThetaJC, ThetaJA, and Temperature Calculations(Doc. No. MV-S700019-00)
Table 61: Thermal Data for the MV78100 in FCBGA Package
Symbol
Definition
Airflow Value (C/W)
0[m/s]
1[m/s]
15.6
0.8
2[m/s]
14.8
0.8
θJA
ψJT
ψJB
θJC
Thermal resistance: junction to ambient
17.4
0.8
Thermal characterization parameter: junction to top center
Thermal characterization parameter: junction to board
10.2
9.9
9.7
Thermal resistance: junction to case
(not air-flow dependent)
0.4
θJB
Thermal resistance: junction to board
(not air-flow dependent)
14.5
MV-S104552-U0 Rev. D
Page 116
Copyright © 2008 Marvell
Document Classification: Proprietary Information
December 6, 2008, Preliminary
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