DA6240.001
20 November 2006
SOLDERING INFORMATION
N
For Lead-Free / Green QFN 3mm x 3mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded.
http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
EMBOSSED TAPE SPECIFICATIONS
P
1
D
0
X
E
W
P
2
P
O
T
F
B
0
R 0.25 typ
A
0
User Direction of Feed
X
K
0
Dimension
A
o
B
o
D
o
E
F
K
o
P
o
P
1
P
2
T
W
Min/Max
3.30
±0.10
3.30
±0.10
1.50 +0.1/-0.0
1.75
5.50
±0.05
1.10
±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00
±0.3
All dimensions in millimeters
Unit
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
Mm
8 (10)
MAS [ MICRO ANALOG SYSTEMS ]
