DA9270.008
11 September 2006
PIN DESCRIPTION
Pin Description
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
Symbol
VDD
PV
CLK
DA
TE1
TE2
VC
X1
X2
VSS
OUT
x-coordinate
166
420
979
1234
1488
1742
185
439
1357
1790
2046
y-coordinate
1430
1435
1441
1441
1441
1441
153
149
149
166
153
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Pin Voltage
Power Dissipation
Storage Temperature
Note 1:
Not valid for programming pin PV
Symbol
V
DD
- V
SS
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Storage Temperature
Crystal Pulling Sensitivity
Crystal Load Capacitance
Symbol
V
DD
I
CC
T
OP
T
S
S
C
L
Conditions
Vdd = 2.8 Volt
Relative humidity =
15%…70%
-30
-45
30
10
Min
2.7
Typ
2.8
Max
5.5
1.8
+85
+40
Unit
V
mA
o
C
o
C
ppm/pF
pF
Note
1)
2)
Note 1:
Minimum Supply Voltage 2.6 V for MAS9270Cxx2 version.
Note 2:
Minimum Operating Temperature –40 ° for MAS9270Cxx3 version.
C
2 (9)
MAS [ MICRO ANALOG SYSTEMS ]
