DA9283.006
13 July 2006
SOLDERING INFORMATION
N For Eutectic Sn/Pb
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Reflow profile
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
1
Moisture Sensitivity Level (MSL)
N For Pb-Free
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
260°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Seating Plane Co-planarity
Lead Finish
Moisture Sensitivity Level (MSL)
Solder plate 7.62 - 25.4 µm, material Matte Tin
1
10 (14)
MAS [ MICRO ANALOG SYSTEMS ]
