DA9285.004
13 July 2006
SOLDERING INFORMATION (QFN-6)
N
For Lead-Free / RoHS Compliant Green QFN 2mm x 2mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded.
http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
EMBOSSED TAPE SPECIFICATIONS (QFN-6)
P
O
P
2
P
1
D
O
X
E
10
O
T
MAX
W
F
B
0
X
User Direction of Feed
A
0
K
0
Detail X-X
Dimension
Ao
Bo
Do
E
F
Ko
Po
P1
P2
T
W
Min/Max
2.30
±0.05
2.30
±0.05
1.50 +0.1/-0.0
1.75
±0.10
3.50
±0.05
1.00
±0.05
4.0
4.0
±0.10
2.0
±0.05
0.254
±0.02
8.00
±0.3/-0.1
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
9 (11)
MAS [ MICRO ANALOG SYSTEMS ]
