DA9275.007
19 February 2004
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded.
http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4
µm,
material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P
1
P
2
E
W
F
P
O
D
O
T
B
O
A
O
User Direction of Feed
A
D
1
Section A-A
K
O
Pin 1 Designator
Dimension
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
Min/Max
5.00
±0.10
3.20
±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50
±0.05
1.45
±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 +0.30/-0.10
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
8 (10)
MAS [ MICRO ANALOG SYSTEMS ]
