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5962-3826707MTQ 参数 Datasheet PDF下载

5962-3826707MTQ图片预览
型号: 5962-3826707MTQ
PDF下载: 下载PDF文件 查看货源
内容描述: 微型电路,存储器,数字, CMOS 128K ×8位EEPROM ,单片硅 [MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON]
分类和应用: 存储可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 40 页 / 315 K
品牌: MAXWELL [ MAXWELL TECHNOLOGIES ]
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4.4.1 Group A inspection.
a.
b.
c.
Tests shall be as specified in table IIA herein.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or design
changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal
and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures and all input and output terminals tested.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device, these tests shall have been fault graded in
accordance with MIL-STD-883, test method 5012 (see 1.5 herein).
O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may
affect the performance of the device. For device class M, procedures and circuits shall be maintained under document
revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon
request. For device classes Q and V, the procedures and circuits shall be under the control of the device manufacturer's
TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity or acquiring activity upon
request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall be considered destructive.
Information contained in JEDEC Standard EIA/JESD78 may be used for reference.
All devices selected for testing shall be programmed with a checkerboard pattern or equivalent. After completion of all
testing, the devices shall be erased and verified, (except devices submitted for groups C and D testing).
d.
e.
f.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M.
a. Steady-state life test conditions, method 1005 of MIL-STD-883:
(1)
(2)
The device selected for testing shall be programmed with a checkerboard pattern. After completion of all testing, the
devices shall be erased and verified (except devices submitted for group D testing).
Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005.
TA = +125
(
C, minimum.
Test duration: 1,000 hours, except as specified in method 1005 of MIL-STD-883.
(3)
(4)
b.
c.
All devices requiring end-point electrical testing shall be programmed with a checkerboard or equivalent alternating bit
pattern.
After the completion of all testing, the devices shall be cleared and verified prior to delivery.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test
circuit shall be maintained under document revision level control by the device manufacturer's TRB, in accordance with MIL-
PRF-38535, and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. The
devices selected for testing shall be programmed with a checkerboard pattern. After completion of all testing, the devices shall be
erased and verified.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-38267
SHEET
13